Thin Film Deposition Systems (Sputtering, E-beam, Thermal, Ion Beam, PLD and Multi-Technique). Ion Beam Etch Systems with SIMS (Ion Milling, RIBE). R&D and Pilot Scale Equipment. UHV and HV Magnetron Sputter Sources and Thermal Evaporation Sources. Wide range of Substrate Holders featuring Azimuthal Rotation, RF/DC Biasing, Heating, Water Cooling, LN2 Cooling and Tilting. Sputter Targets and Evaporation Materials. RF/DC Power Supplies.