Switzer’s advanced photochemical etching process allows an exceptional degree of control that creates exceedingly precise, highly functional RF/Microwave components on a variety of metals from .001" - .125" thick. Our process is extremely agile, making design changes simple and high volumes more practical. Used to supplement photochemical machining or as standalone operations, secondary processes are an important part of our business model as well. Stamping, punching, forming, plating and part assembly are all capabilities that we offer.
Whether it be covers and lids for machined, single or multi-cavity housings – Bandpass Filters, VCOs, Waveguide Filters, Tunable Filters, Diplexers, Integrated Filter Assemblies or housings for Ceramic Filters, let our experts help you optimize your component performance.