Lexatys' dedicated in-house laser micromachining and RF probing capabilities allow design and flexible production of frequency selective modules, components, and assemblies. Product functionality includes low noise amplification, mixing, and filtering inside shielded SMT or hermetically sealed packages. Internal machining capability as well as photonic tuning and wire bonding allow delivery of customized assemblies with short development times. Microwave test equipment including 50 GHz 4-port analyzers enable dynamic tuning of frequency conversion modules. Experienced staff members using AS9100D certified processes deliver complex products reliably and within short time frames.