Ajinomoto Fine-Techno Co., Inc,

Cupertino,  CA 
United States
  • Booth: 325

Ajinomoto Fine-Techno provides electronic materials and function materials such as insulation build-up film called “Ajinomoto Build-up Film” (ABF), low-temperature curable adhesive "PLENSET", transparent optical device encapsulation films "Ajinomoto Encapsulation Film" (AEF), and white insulation film for display backplane.

ABF is the world first build-up film for organic semi-conductor substrate, and it is widely used for the advanced package.

We have developed new ABFs for high reliability and high density Cu wiring.

Meanwhile, PLENSET is low temperature or UV curable one-component epoxy resin adhesives for precision electronic components.

It has been especially contributing for bonding of the heat-sensitive devices.

AEF and white materials were newly developed as a function materials for display utilize the ABF technology and PLENSET technology.

AEF is designed to protect vapor sensitive devices.

Highly advanced display technology require high density Cu circuit, low temperature device implementation and high reliable optical films to avoid vapor absorption, and we sure that we can contribute such industrial demands.

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