LIGHTIZER, THE LEADER OF INNOVATIVE LED TECHNOLOGIES
The Lightizer Corporation, through years of research, has developed the world’s first KSF CSP[chip scale package] technologies and made innovations in Micro LED.
The most important aspects to note in our new KSF CSP technologies are No water, No dicing, No loss, which differentiates it from a conventional CSP process. Our unique process for producing KSF CSP have allowed us to pass 3,000 and 5,000 hour acceleration tests in 85°C, 85% humidity conditions. Furthermore, our mini size KSF CSP are 200 μm x 300 μm, allowing them to possess OLED-like local dimming and high contrast ratios.
Recently, we have made innovations in Micro LED as well, which are based on PR(Photo Resist) in semiconductor technologies. We have created a new concept of Micro LED selective transfer by PR expansion. Due to this, we have superior Transfer Goal Rates and Transfer Costs in mass production. We also believe that we have developed selective transfer and mass transfer technologies for Micro LED.
Our staff has put our best efforts in developing new innovative LED technologies and producing the best LED modules for more than 10 years.
Lightizer possesses technology including LCD BLU, RGB Mini LED signage, wafer-level conformal coating, and Micro LED smartwatch modules. The LCD BLU highlights excellent contrast ratio through local dimming and outstanding color quality with KSF CSP. The smartwatch module features selective transfer technology through PR expansion and excellent chip accuracy.
1. LCD BLU : Our LCD backlight unit is characterized by the outstanding contrast ratio of Local Dimming and the high color quality of the KSF CSP.
2. Signage Product Crafted with RGB Mini LED Technology.
3. Conformal coating : LED chips within the LED wafer exhibit wavelength variations. Individual color conversion is required. Conformal coating with a specific phosphor ratio needs to be applied at the individual chip level.
4. Prototype smartwatch module : This product features Micro LED chip technology, selective transfer technology by PR expansion, and advanced electrical connection with the backplane.