ETRI Superintelligence Creative Research Laboratory
We are developing the novel Mini-/Micro-LED assembly technique, so called simultaneous transfer and bonding (SITRAB) technology. The main highlights of our technology are as follows.
1.SITRAB technology enables the simultaneous transfer and bonding of Mini-/Micro-LEDs on display backplanes without any residue and fume, simplifying the Mini-/Micro-LED display manufacturing.
2.SITRAB technology was conducted at the room temperature, minimizing the misalignment caused by thermally-induced warpage of display substrates and SITRAB interposers for high-resolution Mini-/Micro-LED display fabrication.
3.Owing to the outstanding laser pot life of SITRAB adhesive, the Mini-/Micro-LEDs on the display backplane can be easily trimmed and repaired, which is hardly achieved by conventional epoxy and ACF.