Holst Centre has developed an innovative and proprietary release stack that enables the fast release of micro-LED-sized components with an adaptive pitch and high selectivity using a low-cost laser source. Our technology exhibits exceptional scalability and flexibility, facilitating the transfer of both mini and microLEDs. This advancement not only enables defect management but also offers compatibility with die-on-demand release from ultrahigh-density wafers, achieving die edge-to-edge spacing down to just a few micrometres. Holst Centre’s Laser Die Transfer solution is currently undergoing extensive development, focused on consistently reaching higher transfer accuracy and yield, and validating compatibility with sub-10μm dies and components with complex aspect ratios up to 1:10.