Pixel-Flo has developed an entirely new process for microLED mass transfer, the critical barrier to making microLEDs available at mass market price points. While existing mass transfer technologies achieve reasonable instantaneous mass transfer rates, continuous throughput is severely limited by the changing and loading of wafers, stamps and carriers. Pixel-Flo uniquely offers extremely high continuous throughput and scalability to populate the largest panel sizes. The approach uses a coating method, similar to slot-die, which utilizes meniscus forces to guide the microLED’s into place. The process is compatible with any wafer or backplane and has a single process step for RGB.